Minimization of copper dissolution for lead-free wave soldering in surface mount technology

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Minimization of copper dissolution for lead-free wave soldering in surface mount technology

In today’s surface mount technology, developments are in progress to move towards green manufacturing by converting all leaded soldering process to lead free soldering process. This move has brought towards safer electronic manufacturing and assembly. The conversion has brought goodness for envi...

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Bibliographic Details
Main Author:	Arunasalam, Mageswaran
Format:	Thesis
Language:	English
Published:	2017
Subjects:	Electronic circuits Copper - Dissolution Surface mount technology
Online Access:	http://psasir.upm.edu.my/id/eprint/98188/ http://psasir.upm.edu.my/id/eprint/98188/1/FK%202020%2090%20-%20IR.pdf

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