Arunasalam, M. (2017). Minimization of copper dissolution for lead-free wave soldering in surface mount technology.
Chicago Style (17th ed.) CitationArunasalam, Mageswaran. Minimization of Copper Dissolution for Lead-free Wave Soldering in Surface Mount Technology. 2017.
MLA (9th ed.) CitationArunasalam, Mageswaran. Minimization of Copper Dissolution for Lead-free Wave Soldering in Surface Mount Technology. 2017.
Warning: These citations may not always be 100% accurate.