APA (7th ed.) Citation

K., V., M. A., A. H., Dele-Afolabi, T. T., Matori, K. A., & O., S. A. (2021). Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Elsevier.

Chicago Style (17th ed.) Citation

K., Vidyatharran, Azmah Hanim M. A., T. T. Dele-Afolabi, K. A. Matori, and Saliza Azlina O. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects on Plain Cu and ENIAg Surface Finish. Elsevier, 2021.

MLA (9th ed.) Citation

K., Vidyatharran, et al. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects on Plain Cu and ENIAg Surface Finish. Elsevier, 2021.