Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish

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Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish

In this study, the joint effect of rice husk ash (RHA) reinforcement as an alternative silica source and electroless nickel immersion silver (ENIAg) surface finish on the intermetallic compound (IMC) formation and shear strength of the Sn–0.7Cu solder system was investigated. A series of plain and c...

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Bibliographic Details
Main Authors:	Mohamed Ariff, Azmah Hanim, N., Muhamad Kamil, Wei, Chuan Khang, Temitope T., Dele-Afolabi, Osman, Saliza Azlina
Format:	Article
Language:	English
Published:	Springer Nature 2020
Online Access:	http://psasir.upm.edu.my/id/eprint/86757/ http://psasir.upm.edu.my/id/eprint/86757/1/Microstructural%20and%20shear%20strength%20properties%20of%20RHA.pdf

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