Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
In this study, the joint effect of rice husk ash (RHA) reinforcement as an alternative silica source and electroless nickel immersion silver (ENIAg) surface finish on the intermetallic compound (IMC) formation and shear strength of the Sn–0.7Cu solder system was investigated. A series of plain and c...
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| Format: | Article |
| Language: | English |
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Springer Nature
2020
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| Online Access: | http://psasir.upm.edu.my/id/eprint/86757/ http://psasir.upm.edu.my/id/eprint/86757/1/Microstructural%20and%20shear%20strength%20properties%20of%20RHA.pdf |
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| author | Mohamed Ariff, Azmah Hanim N., Muhamad Kamil Wei, Chuan Khang Temitope T., Dele-Afolabi Osman, Saliza Azlina |
| author_facet | Mohamed Ariff, Azmah Hanim N., Muhamad Kamil Wei, Chuan Khang Temitope T., Dele-Afolabi Osman, Saliza Azlina |
| author_sort | Mohamed Ariff, Azmah Hanim |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | In this study, the joint effect of rice husk ash (RHA) reinforcement as an alternative silica source and electroless nickel immersion silver (ENIAg) surface finish on the intermetallic compound (IMC) formation and shear strength of the Sn–0.7Cu solder system was investigated. A series of plain and composite lead-free solder systems (Sn–0.7Cu−xRHA; x = 0, 0.01, 0.05 and 0.1 wt%) was successfully developed and subjected to reflow soldering on bare Cu and ENIAg surface finish. After conducting a comprehensive microstructural study using the scanning electron microscopy and energy dispersive spectroscopy techniques, the Cu6Sn5 and Cu3Sn intermetallic compound (IMC) phases were observed at the interface of the Sn–0.7Cu−xRHA/Cu composite solder joints. On the other hand, the (Cu,Ni)6Sn5 and Ni3Sn4 IMC phases dominated the interface of the Sn–0.7Cu−xRHA/ENIAg counterparts. Given the promising potential of the ENIAg surface finish, the Sn–0.7Cu−xRHA/ENIAg exhibited IMC thickness values within a range of 3.81–4.74 µm as compared to the 6.13–9.3 µm range exhibited by the Sn–0.7Cu−xRHA/Cu counterpart. More so, the ENIAg surface finish was effective in improving the shear strength of the plain solder joint, with the Sn–0.7Cu/ENIAg exhibiting 13.44 MPa relative to the 11.5 MPa exhibited by the Sn–0.7Cu/Cu counterpart. Overall, the strengthening effect of the RHA reinforcement was well marked in the Sn–0.7Cu−xRHA/Cu composite solder joints with the composite having 0.1 wt% RHA exhibiting the highest shear strength (14.6 MPa) across the board. |
| first_indexed | 2025-11-15T12:42:43Z |
| format | Article |
| id | upm-86757 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T12:42:43Z |
| publishDate | 2020 |
| publisher | Springer Nature |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-867572021-11-16T03:13:34Z http://psasir.upm.edu.my/id/eprint/86757/ Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish Mohamed Ariff, Azmah Hanim N., Muhamad Kamil Wei, Chuan Khang Temitope T., Dele-Afolabi Osman, Saliza Azlina In this study, the joint effect of rice husk ash (RHA) reinforcement as an alternative silica source and electroless nickel immersion silver (ENIAg) surface finish on the intermetallic compound (IMC) formation and shear strength of the Sn–0.7Cu solder system was investigated. A series of plain and composite lead-free solder systems (Sn–0.7Cu−xRHA; x = 0, 0.01, 0.05 and 0.1 wt%) was successfully developed and subjected to reflow soldering on bare Cu and ENIAg surface finish. After conducting a comprehensive microstructural study using the scanning electron microscopy and energy dispersive spectroscopy techniques, the Cu6Sn5 and Cu3Sn intermetallic compound (IMC) phases were observed at the interface of the Sn–0.7Cu−xRHA/Cu composite solder joints. On the other hand, the (Cu,Ni)6Sn5 and Ni3Sn4 IMC phases dominated the interface of the Sn–0.7Cu−xRHA/ENIAg counterparts. Given the promising potential of the ENIAg surface finish, the Sn–0.7Cu−xRHA/ENIAg exhibited IMC thickness values within a range of 3.81–4.74 µm as compared to the 6.13–9.3 µm range exhibited by the Sn–0.7Cu−xRHA/Cu counterpart. More so, the ENIAg surface finish was effective in improving the shear strength of the plain solder joint, with the Sn–0.7Cu/ENIAg exhibiting 13.44 MPa relative to the 11.5 MPa exhibited by the Sn–0.7Cu/Cu counterpart. Overall, the strengthening effect of the RHA reinforcement was well marked in the Sn–0.7Cu−xRHA/Cu composite solder joints with the composite having 0.1 wt% RHA exhibiting the highest shear strength (14.6 MPa) across the board. Springer Nature 2020-04-10 Article PeerReviewed text en http://psasir.upm.edu.my/id/eprint/86757/1/Microstructural%20and%20shear%20strength%20properties%20of%20RHA.pdf Mohamed Ariff, Azmah Hanim and N., Muhamad Kamil and Wei, Chuan Khang and Temitope T., Dele-Afolabi and Osman, Saliza Azlina (2020) Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics, 31 (11). 8316 - 8328. ISSN 0957-4522; ESSN:1573-482X https://link.springer.com/article/10.1007/s10854-020-03367-x 10.1007/s10854-020-03367-x |
| spellingShingle | Mohamed Ariff, Azmah Hanim N., Muhamad Kamil Wei, Chuan Khang Temitope T., Dele-Afolabi Osman, Saliza Azlina Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish |
| title | Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish |
| title_full | Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish |
| title_fullStr | Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish |
| title_full_unstemmed | Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish |
| title_short | Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish |
| title_sort | microstructural and shear strength properties of rha-reinforced sn–0.7cu composite solder joints on bare cu and eniag surface finish |
| url | http://psasir.upm.edu.my/id/eprint/86757/ http://psasir.upm.edu.my/id/eprint/86757/ http://psasir.upm.edu.my/id/eprint/86757/ http://psasir.upm.edu.my/id/eprint/86757/1/Microstructural%20and%20shear%20strength%20properties%20of%20RHA.pdf |