APA (7th ed.) Citation

Mohamed Ariff, A. H., N., M. K., Wei, C. K., Temitope T., D., & Osman, S. A. (2020). Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish. Springer Nature.

Chicago Style (17th ed.) Citation

Mohamed Ariff, Azmah Hanim, Muhamad Kamil N., Chuan Khang Wei, Dele-Afolabi Temitope T., and Saliza Azlina Osman. Microstructural and Shear Strength Properties of RHA-reinforced Sn–0.7Cu Composite Solder Joints on Bare Cu and ENIAg Surface Finish. Springer Nature, 2020.

MLA (9th ed.) Citation

Mohamed Ariff, Azmah Hanim, et al. Microstructural and Shear Strength Properties of RHA-reinforced Sn–0.7Cu Composite Solder Joints on Bare Cu and ENIAg Surface Finish. Springer Nature, 2020.