Drop impact testing for Pb-freee aloy on IC packaging

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Drop impact testing for Pb-freee aloy on IC packaging

Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in...

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Bibliographic Details
Main Authors:	Ismail, Noor Faezah, Sulaiman, Nasri, Md Yunus, Nurul Amziah
Format:	Conference or Workshop Item
Language:	English
Published:	Faculty of Computer Science and Information Technology, Universiti Putra Malaysia 2015
Online Access:	http://psasir.upm.edu.my/id/eprint/77196/ http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf

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