Application of artificial neural network for optimization the wet contact angle for lead free Bi-Ag soldering alloys

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Application of artificial neural network for optimization the wet contact angle for lead free Bi-Ag soldering alloys

In recent years, electronic packaging provides significant research and development challenges across multiple disciplines such as performance, materials, reliability, thermals and interconnections. New technologies and techniques frequently adopted can be implemented in soldering alloys of semicond...

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Bibliographic Details
Main Authors:	Ghamarian, Nima, Mohamed Ariff, Azmah Hanim, Nahavandi, Mahdi, Zainal, Zulkarnain, Lim, Janet Hong Ngee
Format:	Conference or Workshop Item
Language:	English
Published:	2015
Online Access:	http://psasir.upm.edu.my/id/eprint/66185/ http://psasir.upm.edu.my/id/eprint/66185/1/Application%20of%20artificial%20neural%20network%20for%20optimization%20the%20wet%20contact%20angle%20for%20lead%20free%20Bi-Ag%20soldering%20alloys.pdf

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