Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
Sn-Ag-Cu lead free solder is a well-known studied material replacing the Sn-Pb solder which is prohibited due to the toxicity of lead. Even though it is proven to have good reliability and mechanical properties, Sn-Ag-Cu is lacking in terms of melting point and wettability. Previously, research has...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/66184/ http://psasir.upm.edu.my/id/eprint/66184/1/Potential%20enhancement%20in%20mechanical%20and%20physical%20properties%20of%20Sn-Ag-Cu%20lead%20free%20solder%20as%20a%20replacement%20material%20for%20Sn-Pb%20in%20electronic%20packaging.pdf |
| _version_ | 1848855495624884224 |
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| author | Mat Hussin, Nur Liyana Mohamed Ariff, Azmah Hanim Sulaiman, Shamsuddin Osman, Saliza Azlina |
| author_facet | Mat Hussin, Nur Liyana Mohamed Ariff, Azmah Hanim Sulaiman, Shamsuddin Osman, Saliza Azlina |
| author_sort | Mat Hussin, Nur Liyana |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | Sn-Ag-Cu lead free solder is a well-known studied material replacing the Sn-Pb solder which is prohibited due to the toxicity of lead. Even though it is proven to have good reliability and mechanical properties, Sn-Ag-Cu is lacking in terms of melting point and wettability. Previously, research has been focused on further enhancement of Sn-Ag-Cu solder by addition of alloying elements, nanoparticles and others. In this paper, a critical review of the work on the enhancement of the mechanical and physical properties of Sn-Ag-Cu solder using this method for its application in electronic packaging is explored. |
| first_indexed | 2025-11-15T11:26:40Z |
| format | Conference or Workshop Item |
| id | upm-66184 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T11:26:40Z |
| publishDate | 2015 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-661842019-02-12T06:46:29Z http://psasir.upm.edu.my/id/eprint/66184/ Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging Mat Hussin, Nur Liyana Mohamed Ariff, Azmah Hanim Sulaiman, Shamsuddin Osman, Saliza Azlina Sn-Ag-Cu lead free solder is a well-known studied material replacing the Sn-Pb solder which is prohibited due to the toxicity of lead. Even though it is proven to have good reliability and mechanical properties, Sn-Ag-Cu is lacking in terms of melting point and wettability. Previously, research has been focused on further enhancement of Sn-Ag-Cu solder by addition of alloying elements, nanoparticles and others. In this paper, a critical review of the work on the enhancement of the mechanical and physical properties of Sn-Ag-Cu solder using this method for its application in electronic packaging is explored. 2015 Conference or Workshop Item PeerReviewed text en http://psasir.upm.edu.my/id/eprint/66184/1/Potential%20enhancement%20in%20mechanical%20and%20physical%20properties%20of%20Sn-Ag-Cu%20lead%20free%20solder%20as%20a%20replacement%20material%20for%20Sn-Pb%20in%20electronic%20packaging.pdf Mat Hussin, Nur Liyana and Mohamed Ariff, Azmah Hanim and Sulaiman, Shamsuddin and Osman, Saliza Azlina (2015) Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging. In: INTROP Research Colloquim 2015, 1-2 Dec. 2015, RHR Hotel, Uniten, Putrajaya. . |
| spellingShingle | Mat Hussin, Nur Liyana Mohamed Ariff, Azmah Hanim Sulaiman, Shamsuddin Osman, Saliza Azlina Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging |
| title | Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging |
| title_full | Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging |
| title_fullStr | Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging |
| title_full_unstemmed | Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging |
| title_short | Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging |
| title_sort | potential enhancement in mechanical and physical properties of sn-ag-cu lead free solder as a replacement material for sn-pb in electronic packaging |
| url | http://psasir.upm.edu.my/id/eprint/66184/ http://psasir.upm.edu.my/id/eprint/66184/1/Potential%20enhancement%20in%20mechanical%20and%20physical%20properties%20of%20Sn-Ag-Cu%20lead%20free%20solder%20as%20a%20replacement%20material%20for%20Sn-Pb%20in%20electronic%20packaging.pdf |