APA (7th ed.) Citation

Mat Hussin, N. L., Mohamed Ariff, A. H., Sulaiman, S., & Osman, S. A. (2015). Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging.

Chicago Style (17th ed.) Citation

Mat Hussin, Nur Liyana, Azmah Hanim Mohamed Ariff, Shamsuddin Sulaiman, and Saliza Azlina Osman. Potential Enhancement in Mechanical and Physical Properties of Sn-Ag-Cu Lead Free Solder as a Replacement Material for Sn-Pb in Electronic Packaging. 2015.

MLA (9th ed.) Citation

Mat Hussin, Nur Liyana, et al. Potential Enhancement in Mechanical and Physical Properties of Sn-Ag-Cu Lead Free Solder as a Replacement Material for Sn-Pb in Electronic Packaging. 2015.