Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Mult...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/66182/ http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf |
| _version_ | 1848855495080673280 |
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| author | Mohd Najib, Mohamad Aznan Mohamed Ariff, Azmah Hanim Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin |
| author_facet | Mohd Najib, Mohamad Aznan Mohamed Ariff, Azmah Hanim Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin |
| author_sort | Mohd Najib, Mohamad Aznan |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Multi-Walled Carbon Nanotubes (MWCNTs) was mixed to form a composite solder paste and soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical microscope with image analyzer. Results show that the thickness of IMC layer for ENIG and ImSn were 1.49 µm and 2.51 µm respectively. Floating IMC and voids within the solder bulk and IMC layer were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were 16.21° and 34.32°. |
| first_indexed | 2025-11-15T11:26:40Z |
| format | Conference or Workshop Item |
| id | upm-66182 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T11:26:40Z |
| publishDate | 2015 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-661822019-02-12T06:46:20Z http://psasir.upm.edu.my/id/eprint/66182/ Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes Mohd Najib, Mohamad Aznan Mohamed Ariff, Azmah Hanim Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Multi-Walled Carbon Nanotubes (MWCNTs) was mixed to form a composite solder paste and soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical microscope with image analyzer. Results show that the thickness of IMC layer for ENIG and ImSn were 1.49 µm and 2.51 µm respectively. Floating IMC and voids within the solder bulk and IMC layer were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were 16.21° and 34.32°. 2015 Conference or Workshop Item PeerReviewed text en http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf Mohd Najib, Mohamad Aznan and Mohamed Ariff, Azmah Hanim and Roslan, Muhammad Raimi and Anuar, Muhammad Azrol Amin (2015) Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes. In: INTROP Research Colloquim 2015, 1-2 Dec. 2015, RHR Hotel, Uniten, Putrajaya. . |
| spellingShingle | Mohd Najib, Mohamad Aznan Mohamed Ariff, Azmah Hanim Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes |
| title | Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes |
| title_full | Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes |
| title_fullStr | Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes |
| title_full_unstemmed | Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes |
| title_short | Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes |
| title_sort | intermetallic growth of sac237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes |
| url | http://psasir.upm.edu.my/id/eprint/66182/ http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf |