Electroless plating as surface finishing in electronic packaging
Electroless plating is one type of surface finish deposition method in electronic packaging. With advancements in electronic products, the industry is shifting toward this process based on its advantages. However, the electroless plating process itself is unstable. Its stability fully depends on the...
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| Format: | Book Section |
| Language: | English |
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Elsevier
2017
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| Online Access: | http://psasir.upm.edu.my/id/eprint/63090/ http://psasir.upm.edu.my/id/eprint/63090/1/Electroless%20plating%20as%20surface%20finishing%20in%20electronic%20packaging.pdf |
| _version_ | 1848854718717100032 |
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| author | Mohamed Ariff, Azmah Hanim |
| author_facet | Mohamed Ariff, Azmah Hanim |
| author_sort | Mohamed Ariff, Azmah Hanim |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | Electroless plating is one type of surface finish deposition method in electronic packaging. With advancements in electronic products, the industry is shifting toward this process based on its advantages. However, the electroless plating process itself is unstable. Its stability fully depends on the substrate material, the pretreatment process, the type of solution used, and the pH and temperature during plating. In this article, focus is given to the three different types of electroless plating formulations used in electronic packaging that have been studied by previous researchers: electroless nickel, electroless palladium, and electroless gold. |
| first_indexed | 2025-11-15T11:14:19Z |
| format | Book Section |
| id | upm-63090 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T11:14:19Z |
| publishDate | 2017 |
| publisher | Elsevier |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-630902020-03-17T08:36:06Z http://psasir.upm.edu.my/id/eprint/63090/ Electroless plating as surface finishing in electronic packaging Mohamed Ariff, Azmah Hanim Electroless plating is one type of surface finish deposition method in electronic packaging. With advancements in electronic products, the industry is shifting toward this process based on its advantages. However, the electroless plating process itself is unstable. Its stability fully depends on the substrate material, the pretreatment process, the type of solution used, and the pH and temperature during plating. In this article, focus is given to the three different types of electroless plating formulations used in electronic packaging that have been studied by previous researchers: electroless nickel, electroless palladium, and electroless gold. Elsevier 2017 Book Section PeerReviewed text en http://psasir.upm.edu.my/id/eprint/63090/1/Electroless%20plating%20as%20surface%20finishing%20in%20electronic%20packaging.pdf Mohamed Ariff, Azmah Hanim (2017) Electroless plating as surface finishing in electronic packaging. In: Comprehensive Materials Finishing. Elsevier, Oxford. ISBN 978-0-12-803249-7 http://www.prims.upm.edu.my/uploads/2016/410902_isbn number book plating.pdf , http://www.prims.upm.edu.my/uploads/2016/410903_chapter buku-electroless plating.pdf 10.1016/B978-0-12-803581-8.09177-3 |
| spellingShingle | Mohamed Ariff, Azmah Hanim Electroless plating as surface finishing in electronic packaging |
| title | Electroless plating as surface finishing in electronic packaging |
| title_full | Electroless plating as surface finishing in electronic packaging |
| title_fullStr | Electroless plating as surface finishing in electronic packaging |
| title_full_unstemmed | Electroless plating as surface finishing in electronic packaging |
| title_short | Electroless plating as surface finishing in electronic packaging |
| title_sort | electroless plating as surface finishing in electronic packaging |
| url | http://psasir.upm.edu.my/id/eprint/63090/ http://psasir.upm.edu.my/id/eprint/63090/ http://psasir.upm.edu.my/id/eprint/63090/ http://psasir.upm.edu.my/id/eprint/63090/1/Electroless%20plating%20as%20surface%20finishing%20in%20electronic%20packaging.pdf |