Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging

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Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging

Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an impor...

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Bibliographic Details
Main Author:	Dharmalingam, Sivakumar
Format:	Thesis
Language:	English
Published:	2004
Subjects:	Microelectronic packaging - Total roduction maintenance - Case studies
Online Access:	http://psasir.upm.edu.my/id/eprint/5897/ http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf

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