Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an impor...
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| Format: | Thesis |
| Language: | English |
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2004
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| Online Access: | http://psasir.upm.edu.my/id/eprint/5897/ http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf |
| _version_ | 1848840226052505600 |
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| author | Dharmalingam, Sivakumar |
| author_facet | Dharmalingam, Sivakumar |
| author_sort | Dharmalingam, Sivakumar |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss
or waste due to equipment failure or defect. TPM is designed to get maximum
efficiency from the equipment while creating a satisfactory working environment. In
Motorola, Selangor yield improvement had been an important agenda. One of the
TPM pillar which is Focus Improvement activity is designed to minimize targeted
losses that had been carefully measured and evaluated, was employed to improve
yield in front-end assembly. The top three yield lost in parts per million (ppm) were
contributed by the following defects in descending order: Non Stick on Pad (2715
ppm), chip and crack (782 ppm) and missing wire (687 ppni). The team focused on
Non Stick on Pad (NSOP). which was the top yield lost contributor. NSOP was due
to: floating die, bonded ball small in size, foreign matter on pad and classifications to
say a few. Floating die contributed 48% of the NSOP defect. In this project detailed |
| first_indexed | 2025-11-15T07:23:58Z |
| format | Thesis |
| id | upm-5897 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T07:23:58Z |
| publishDate | 2004 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-58972022-02-03T01:50:18Z http://psasir.upm.edu.my/id/eprint/5897/ Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging Dharmalingam, Sivakumar Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an important agenda. One of the TPM pillar which is Focus Improvement activity is designed to minimize targeted losses that had been carefully measured and evaluated, was employed to improve yield in front-end assembly. The top three yield lost in parts per million (ppm) were contributed by the following defects in descending order: Non Stick on Pad (2715 ppm), chip and crack (782 ppm) and missing wire (687 ppni). The team focused on Non Stick on Pad (NSOP). which was the top yield lost contributor. NSOP was due to: floating die, bonded ball small in size, foreign matter on pad and classifications to say a few. Floating die contributed 48% of the NSOP defect. In this project detailed 2004-02 Thesis NonPeerReviewed text en http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf Dharmalingam, Sivakumar (2004) Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging. Masters thesis, Universiti Putra Malaysia. Microelectronic packaging - Total roduction maintenance - Case studies |
| spellingShingle | Microelectronic packaging - Total roduction maintenance - Case studies Dharmalingam, Sivakumar Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging |
| title | Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging |
| title_full | Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging |
| title_fullStr | Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging |
| title_full_unstemmed | Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging |
| title_short | Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging |
| title_sort | application of focus improvement to reduce non-stick on pad problem in ic packaging |
| topic | Microelectronic packaging - Total roduction maintenance - Case studies |
| url | http://psasir.upm.edu.my/id/eprint/5897/ http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf |