Application of artificial neural networks for the optimisation of wetting contact angle for lead free Bi-Ag soldering alloys
In the recent years, electronic packaging provides significant research and development challenges across multiple disciplines such as performance, materials, reliability, thermals and interconnections. New technologies and techniques frequently adopted can be implemented in soldering alloys of semi...
| Main Authors: | Ghamarian, Nima, Mohamed Ariff, Azmah Hanim, Nahavandi, Mahdi, Zainal, Zulkarnain, Lim, Hong Ngee |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Universiti Putra Malaysia Press
2017
|
| Online Access: | http://psasir.upm.edu.my/id/eprint/58327/ http://psasir.upm.edu.my/id/eprint/58327/1/17%20JST%28S%29-0286-2017-2ndProof.pdf |
Similar Items
Application of artificial neural network for optimization the wet contact angle for lead free Bi-Ag soldering alloys
by: Ghamarian, Nima, et al.
Published: (2015)
by: Ghamarian, Nima, et al.
Published: (2015)
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
by: Nahavandi, Mahdi
Published: (2014)
by: Nahavandi, Mahdi
Published: (2014)
Electrical and corrosion characterisation of nano-composite eutectic Bi-Ag solder alloy reinforced with multi-wall carbon nanotube and multi-layer graphene
by: Ghamarian, Nima, et al.
Published: (2020)
by: Ghamarian, Nima, et al.
Published: (2020)
Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
by: Nahavandi, Mahdi, et al.
Published: (2014)
by: Nahavandi, Mahdi, et al.
Published: (2014)
Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number
by: Nahavandi, Mahdi, et al.
Published: (2014)
by: Nahavandi, Mahdi, et al.
Published: (2014)
Bi-Ag as an alternative high temperature solder
by: Rosilli, Rohaizuan, et al.
Published: (2014)
by: Rosilli, Rohaizuan, et al.
Published: (2014)
Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
Characterization of multi-wall carbon nanotube/multi- layer graphene fibre-reinforced solder alloy composites
by: Ghamarian, Nima
Published: (2017)
by: Ghamarian, Nima
Published: (2017)
Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2018)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2018)
Aerial wetting contact angle measurement using confocal microscopy
by: Chesna, Jacob W., et al.
Published: (2016)
by: Chesna, Jacob W., et al.
Published: (2016)
Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
by: Kamarudin, Maslina
Published: (2015)
by: Kamarudin, Maslina
Published: (2015)
Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
by: Bakir, Mohammed Luay
Published: (2012)
by: Bakir, Mohammed Luay
Published: (2012)
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)
by: Abu Hassan, Nurfazlin
Published: (2009)
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)
by: Idris, Siti Rabiatull Aisha
Published: (2008)
The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish
by: Osman, Saliza Azlina, et al.
Published: (2014)
by: Osman, Saliza Azlina, et al.
Published: (2014)
Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper
by: M.A., Rabiatul Adawiyah, et al.
Published: (2017)
by: M.A., Rabiatul Adawiyah, et al.
Published: (2017)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
by: Mayappan, Ramani
Published: (2007)
by: Mayappan, Ramani
Published: (2007)
Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)
Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review
by: Dele-Afolabi, T. T., et al.
Published: (2014)
by: Dele-Afolabi, T. T., et al.
Published: (2014)
Optimization On Laser Soldering Parameters Onto Lead-Free Solder Joint
by: T. J., Nabila, et al.
Published: (2017)
by: T. J., Nabila, et al.
Published: (2017)
Thermomigration in lead-free solder joints
by: Abdul Hamid, M. F, et al.
Published: (2008)
by: Abdul Hamid, M. F, et al.
Published: (2008)
Characterization of CrAg Bi-layer thin metal contacts sputter deposited on N-type si semiconductor
by: Ali, Ahmad Hadi, et al.
Published: (2018)
by: Ali, Ahmad Hadi, et al.
Published: (2018)
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024)
by: Muhammad Asyraf, Abdullah
Published: (2024)
Synthesis and characterization of zinc oxide nanorods sensitised by Bi₂S₃, Ag₂S and Ag₂S-Bi₂S₃ for photoelectrochemical application
by: Abdullah M., Alzahrani Asla
Published: (2020)
by: Abdullah M., Alzahrani Asla
Published: (2020)
Bismuth-argentum alloys as alternative high temperature lead-free solder
by: Rosilli, Rohaizuan
Published: (2012)
by: Rosilli, Rohaizuan
Published: (2012)
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies
by: Dele-Afolabi, T.T., et al.
Published: (2023)
by: Dele-Afolabi, T.T., et al.
Published: (2023)
Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2013)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2013)
Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017)
by: Tan, Ai Ting
Published: (2017)
Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
by: Nor Adhila Muhammad,, et al.
Published: (2014)
by: Nor Adhila Muhammad,, et al.
Published: (2014)
Considering the effect of angle on polymer insulator performance under wet condition
by: Abd Rahman, Muhammad Syahmi, et al.
Published: (2015)
by: Abd Rahman, Muhammad Syahmi, et al.
Published: (2015)
Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)
Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2015)
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2015)
Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2015)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2015)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)
by: Yahya, Iziana
Published: (2016)
Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
by: Mohamed Anuar, Rabiatul Adawiyah
Published: (2017)
by: Mohamed Anuar, Rabiatul Adawiyah
Published: (2017)
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
by: Nabila, Tamar Jaya
Published: (2024)
by: Nabila, Tamar Jaya
Published: (2024)
Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)
Similar Items
-
Application of artificial neural network for optimization the wet contact angle for lead free Bi-Ag soldering alloys
by: Ghamarian, Nima, et al.
Published: (2015) -
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
by: Nahavandi, Mahdi
Published: (2014) -
Electrical and corrosion characterisation of nano-composite eutectic Bi-Ag solder alloy reinforced with multi-wall carbon nanotube and multi-layer graphene
by: Ghamarian, Nima, et al.
Published: (2020) -
Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
by: Nahavandi, Mahdi, et al.
Published: (2014) -
Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number
by: Nahavandi, Mahdi, et al.
Published: (2014)