Intermetallic growth of SAC237 solder paste reinforced with MWCNT

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Intermetallic growth of SAC237 solder paste reinforced with MWCNT

The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes has been studied. The growth of IMC layer as a reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%), reinforced with 0.01 wt.% Multi-Wa...

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Bibliographic Details
Main Authors:	Mohamed Ariff, Azmah Hanim, Mohd Najib, Mohamad Aznan, Roslan, Muhammad Raimi, Anuar, Muhammad Azrol Amin
Format:	Article
Language:	English
Published:	Universiti Putra Malaysia Press 2017
Online Access:	http://psasir.upm.edu.my/id/eprint/58326/ http://psasir.upm.edu.my/id/eprint/58326/1/16%20JST%28S%29-0284-2017-2ndProof.pdf

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