Intermetallic growth of SAC237 solder paste reinforced with MWCNT
The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes has been studied. The growth of IMC layer as a reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%), reinforced with 0.01 wt.% Multi-Wa...
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| Format: | Article |
| Language: | English |
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Universiti Putra Malaysia Press
2017
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| Online Access: | http://psasir.upm.edu.my/id/eprint/58326/ http://psasir.upm.edu.my/id/eprint/58326/1/16%20JST%28S%29-0284-2017-2ndProof.pdf |
| _version_ | 1848853615372926976 |
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| author | Mohamed Ariff, Azmah Hanim Mohd Najib, Mohamad Aznan Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin |
| author_facet | Mohamed Ariff, Azmah Hanim Mohd Najib, Mohamad Aznan Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin |
| author_sort | Mohamed Ariff, Azmah Hanim |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes has been studied. The growth of IMC layer as a reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%), reinforced with 0.01 wt.% Multi-Walled Carbon Nanotubes (MWCNTs), was mixed to form a composite solder paste and soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical microscope with image analyser. Results showed that the thickness of IMC layer for ENIG and ImSn were 1.49 and 2.51 µm, respectively. Floating IMC and voids within the solder bulk and IMC layer were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were 16.21° and 34.32°, respectively. |
| first_indexed | 2025-11-15T10:56:47Z |
| format | Article |
| id | upm-58326 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T10:56:47Z |
| publishDate | 2017 |
| publisher | Universiti Putra Malaysia Press |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-583262019-01-08T07:53:57Z http://psasir.upm.edu.my/id/eprint/58326/ Intermetallic growth of SAC237 solder paste reinforced with MWCNT Mohamed Ariff, Azmah Hanim Mohd Najib, Mohamad Aznan Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes has been studied. The growth of IMC layer as a reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%), reinforced with 0.01 wt.% Multi-Walled Carbon Nanotubes (MWCNTs), was mixed to form a composite solder paste and soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical microscope with image analyser. Results showed that the thickness of IMC layer for ENIG and ImSn were 1.49 and 2.51 µm, respectively. Floating IMC and voids within the solder bulk and IMC layer were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were 16.21° and 34.32°, respectively. Universiti Putra Malaysia Press 2017 Article PeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/58326/1/16%20JST%28S%29-0284-2017-2ndProof.pdf Mohamed Ariff, Azmah Hanim and Mohd Najib, Mohamad Aznan and Roslan, Muhammad Raimi and Anuar, Muhammad Azrol Amin (2017) Intermetallic growth of SAC237 solder paste reinforced with MWCNT. Pertanika Journal of Science & Technology, 25 (4). pp. 1249-1254. ISSN 0128-7680; ESSN: 2231-8526 http://www.pertanika.upm.edu.my/Pertanika%20PAPERS/JST%20Vol.%2025%20(4)%20Oct.%202017/16%20JST(S)-0284-2017-2ndProof.pdf |
| spellingShingle | Mohamed Ariff, Azmah Hanim Mohd Najib, Mohamad Aznan Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin Intermetallic growth of SAC237 solder paste reinforced with MWCNT |
| title | Intermetallic growth of SAC237 solder paste reinforced with MWCNT |
| title_full | Intermetallic growth of SAC237 solder paste reinforced with MWCNT |
| title_fullStr | Intermetallic growth of SAC237 solder paste reinforced with MWCNT |
| title_full_unstemmed | Intermetallic growth of SAC237 solder paste reinforced with MWCNT |
| title_short | Intermetallic growth of SAC237 solder paste reinforced with MWCNT |
| title_sort | intermetallic growth of sac237 solder paste reinforced with mwcnt |
| url | http://psasir.upm.edu.my/id/eprint/58326/ http://psasir.upm.edu.my/id/eprint/58326/ http://psasir.upm.edu.my/id/eprint/58326/1/16%20JST%28S%29-0284-2017-2ndProof.pdf |