APA (7th ed.) Citation

Mohamed Ariff, A. H., M. N., M. A., R., M. R., & A., M. A. A. (2016). Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging. Trans Tech Publications.

Chicago Style (17th ed.) Citation

Mohamed Ariff, Azmah Hanim, Mohamad Aznan M. N., Muhammad Raimi R., and Muhammad Azrol Amin A. Interfacial Reaction Analysis of Sn-Ag-Cu Solder Reinforced with 0.01wt% CNTs with Isothermal Aging. Trans Tech Publications, 2016.

MLA (9th ed.) Citation

Mohamed Ariff, Azmah Hanim, et al. Interfacial Reaction Analysis of Sn-Ag-Cu Solder Reinforced with 0.01wt% CNTs with Isothermal Aging. Trans Tech Publications, 2016.