Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes

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Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes

In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...

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Bibliographic Details
Main Authors:	Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina
Format:	Article
Language:	English
Published:	Universiti Malaysia Pahang Publisher 2015
Online Access:	http://psasir.upm.edu.my/id/eprint/51992/ http://psasir.upm.edu.my/id/eprint/51992/1/Thermal%20cyclic%20test%20for.pdf

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