DMTA studies of the effect of storage time on the curing process of sheet moulding compound

The application of the dynamic mechanical thermal analysis (DMTA) test method in the study of the effect of storage time on the curing process of sheet moulding compound (SMC) is discussed. Emphasis is placed on following the curing by the study of storage modulus and loss tangent with storage time....

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Main Authors: Hamdan, Sinin, Awang Hashim, Dayang Maryani, Fong, S. W.
Format: Article
Language:English
English
Published: IOP Publishing 1998
Online Access:http://psasir.upm.edu.my/id/eprint/51152/
http://psasir.upm.edu.my/id/eprint/51152/1/51152.pdf
http://psasir.upm.edu.my/id/eprint/51152/7/51152.pdf
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author Hamdan, Sinin
Awang Hashim, Dayang Maryani
Fong, S. W.
author_facet Hamdan, Sinin
Awang Hashim, Dayang Maryani
Fong, S. W.
author_sort Hamdan, Sinin
building UPM Institutional Repository
collection Online Access
description The application of the dynamic mechanical thermal analysis (DMTA) test method in the study of the effect of storage time on the curing process of sheet moulding compound (SMC) is discussed. Emphasis is placed on following the curing by the study of storage modulus and loss tangent with storage time. Changes in the storage time showed an increase in the storage modulus (log E′) during a room-temperature cure. The loss tangent (tan δ) damping peak occurs as the system is driven into the glassy state by the cross-linking reaction. The SMC displayed a room-temperature log E′ of 8.5 Pa which increased to approximately 9 Pa in the subsequent scan in the DMTA.
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English
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publishDate 1998
publisher IOP Publishing
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spelling upm-511522024-10-15T04:11:36Z http://psasir.upm.edu.my/id/eprint/51152/ DMTA studies of the effect of storage time on the curing process of sheet moulding compound Hamdan, Sinin Awang Hashim, Dayang Maryani Fong, S. W. The application of the dynamic mechanical thermal analysis (DMTA) test method in the study of the effect of storage time on the curing process of sheet moulding compound (SMC) is discussed. Emphasis is placed on following the curing by the study of storage modulus and loss tangent with storage time. Changes in the storage time showed an increase in the storage modulus (log E′) during a room-temperature cure. The loss tangent (tan δ) damping peak occurs as the system is driven into the glassy state by the cross-linking reaction. The SMC displayed a room-temperature log E′ of 8.5 Pa which increased to approximately 9 Pa in the subsequent scan in the DMTA. IOP Publishing 1998 Article PeerReviewed text en http://psasir.upm.edu.my/id/eprint/51152/1/51152.pdf text en http://psasir.upm.edu.my/id/eprint/51152/7/51152.pdf Hamdan, Sinin and Awang Hashim, Dayang Maryani and Fong, S. W. (1998) DMTA studies of the effect of storage time on the curing process of sheet moulding compound. High Performance Polymers, 10 (4). pp. 331-340. ISSN 0954-0083 http://journals.sagepub.com/doi/abs/10.1088/0954-0083/10/4/001 10.1088/0954-0083/10/4/001
spellingShingle Hamdan, Sinin
Awang Hashim, Dayang Maryani
Fong, S. W.
DMTA studies of the effect of storage time on the curing process of sheet moulding compound
title DMTA studies of the effect of storage time on the curing process of sheet moulding compound
title_full DMTA studies of the effect of storage time on the curing process of sheet moulding compound
title_fullStr DMTA studies of the effect of storage time on the curing process of sheet moulding compound
title_full_unstemmed DMTA studies of the effect of storage time on the curing process of sheet moulding compound
title_short DMTA studies of the effect of storage time on the curing process of sheet moulding compound
title_sort dmta studies of the effect of storage time on the curing process of sheet moulding compound
url http://psasir.upm.edu.my/id/eprint/51152/
http://psasir.upm.edu.my/id/eprint/51152/
http://psasir.upm.edu.my/id/eprint/51152/
http://psasir.upm.edu.my/id/eprint/51152/1/51152.pdf
http://psasir.upm.edu.my/id/eprint/51152/7/51152.pdf