Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk

The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic...

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Main Authors: Wong, K. K., Lee, Chnoong Kheng, Low, Kun She, Haron, Md. Jelas
Format: Article
Language:English
English
Published: Elsevier 2003
Online Access:http://psasir.upm.edu.my/id/eprint/40033/
http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf
http://psasir.upm.edu.my/id/eprint/40033/7/1-s2.0-S0032959203000943-main.pdf
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author Wong, K. K.
Lee, Chnoong Kheng
Low, Kun She
Haron, Md. Jelas
author_facet Wong, K. K.
Lee, Chnoong Kheng
Low, Kun She
Haron, Md. Jelas
author_sort Wong, K. K.
building UPM Institutional Repository
collection Online Access
description The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic solution and wastewater. A series of column studies were carried out. Increase in column bed depth yielded longer service time while increase in influent concentration and flow rate resulted in faster breakthrough. The sorption capacities of the TARH column for Cu and Pb agreed closely with the levels obtained from batch equilibrium studies. Theoretical breakthrough curves at different bed heights and flow rates generated using a two-parameter model agreed closely with experimental values in the treatment of semiconductor wastewater. In the regeneration study, Cu and Pb could be recovered almost quantitatively by eluting the column with 0.1 M HCl and the column could be used repeatedly for at least five cycles.
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institution Universiti Putra Malaysia
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language English
English
last_indexed 2025-11-15T09:48:22Z
publishDate 2003
publisher Elsevier
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spelling upm-400332024-07-19T08:29:51Z http://psasir.upm.edu.my/id/eprint/40033/ Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic solution and wastewater. A series of column studies were carried out. Increase in column bed depth yielded longer service time while increase in influent concentration and flow rate resulted in faster breakthrough. The sorption capacities of the TARH column for Cu and Pb agreed closely with the levels obtained from batch equilibrium studies. Theoretical breakthrough curves at different bed heights and flow rates generated using a two-parameter model agreed closely with experimental values in the treatment of semiconductor wastewater. In the regeneration study, Cu and Pb could be recovered almost quantitatively by eluting the column with 0.1 M HCl and the column could be used repeatedly for at least five cycles. Elsevier 2003-12 Article PeerReviewed text en http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf text en http://psasir.upm.edu.my/id/eprint/40033/7/1-s2.0-S0032959203000943-main.pdf Wong, K. K. and Lee, Chnoong Kheng and Low, Kun She and Haron, Md. Jelas (2003) Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk. Process Biochemistry, 39 (4). pp. 437-445. ISSN 1359-5113; ESSN: 1873-3298 http://www.sciencedirect.com/science/article/pii/S0032959203000943 10.1016/S0032-9592(03)00094-3
spellingShingle Wong, K. K.
Lee, Chnoong Kheng
Low, Kun She
Haron, Md. Jelas
Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_full Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_fullStr Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_full_unstemmed Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_short Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_sort removal of cu and pb from electroplating wastewater using tartaric acid modified rice husk
url http://psasir.upm.edu.my/id/eprint/40033/
http://psasir.upm.edu.my/id/eprint/40033/
http://psasir.upm.edu.my/id/eprint/40033/
http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf
http://psasir.upm.edu.my/id/eprint/40033/7/1-s2.0-S0032959203000943-main.pdf