APA (7th ed.) Citation

Nahavandi, M., Mohamed Ariff, A. H., Zahari, N. I., & Baserfalak, F. (2014). Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number. Trans Tech Publications.

Chicago Style (17th ed.) Citation

Nahavandi, Mahdi, Azmah Hanim Mohamed Ariff, Nur Ismarrubie Zahari, and F. Baserfalak. Microstructural Evaluation of Bi-Ag and Bi-Sb Lead-free High-temperature Solder Candidates on Copper Substrate with Multiple Reflow Number. Trans Tech Publications, 2014.

MLA (9th ed.) Citation

Nahavandi, Mahdi, et al. Microstructural Evaluation of Bi-Ag and Bi-Sb Lead-free High-temperature Solder Candidates on Copper Substrate with Multiple Reflow Number. Trans Tech Publications, 2014.