Alumina substrate for high frequency applications

The rapidly growing wireless industry needs new high performance materials to build low loss, high density, thermally stable integrated packages. Ceramic is one of the materials that can be used for thick film technology in high frequency application due the excellent combination of electrical, the...

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Main Authors: Alias, Rosidah, Ibrahim, Azmi, Mohd Shapee, Sabrina, Yahya, Mohamed Razman, Awang Mat, Abd. Fatah, Hashim, Mansor
Format: Conference or Workshop Item
Language:English
Published: Universiti Putra Malaysia Press 2005
Online Access:http://psasir.upm.edu.my/id/eprint/34001/
http://psasir.upm.edu.my/id/eprint/34001/1/34001.pdf
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author Alias, Rosidah
Ibrahim, Azmi
Mohd Shapee, Sabrina
Yahya, Mohamed Razman
Awang Mat, Abd. Fatah
Hashim, Mansor
author_facet Alias, Rosidah
Ibrahim, Azmi
Mohd Shapee, Sabrina
Yahya, Mohamed Razman
Awang Mat, Abd. Fatah
Hashim, Mansor
author_sort Alias, Rosidah
building UPM Institutional Repository
collection Online Access
description The rapidly growing wireless industry needs new high performance materials to build low loss, high density, thermally stable integrated packages. Ceramic is one of the materials that can be used for thick film technology in high frequency application due the excellent combination of electrical, thermal and mechanical properties. This paper discusses some properties of alumina substrate which suitable for microwave applications.
first_indexed 2025-11-15T09:22:01Z
format Conference or Workshop Item
id upm-34001
institution Universiti Putra Malaysia
institution_category Local University
language English
last_indexed 2025-11-15T09:22:01Z
publishDate 2005
publisher Universiti Putra Malaysia Press
recordtype eprints
repository_type Digital Repository
spelling upm-340012018-09-25T01:55:59Z http://psasir.upm.edu.my/id/eprint/34001/ Alumina substrate for high frequency applications Alias, Rosidah Ibrahim, Azmi Mohd Shapee, Sabrina Yahya, Mohamed Razman Awang Mat, Abd. Fatah Hashim, Mansor The rapidly growing wireless industry needs new high performance materials to build low loss, high density, thermally stable integrated packages. Ceramic is one of the materials that can be used for thick film technology in high frequency application due the excellent combination of electrical, thermal and mechanical properties. This paper discusses some properties of alumina substrate which suitable for microwave applications. Universiti Putra Malaysia Press 2005 Conference or Workshop Item NonPeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/34001/1/34001.pdf Alias, Rosidah and Ibrahim, Azmi and Mohd Shapee, Sabrina and Yahya, Mohamed Razman and Awang Mat, Abd. Fatah and Hashim, Mansor (2005) Alumina substrate for high frequency applications. In: International Advanced Technology Congress: Conference on Advanced Materials (CAM 2005), 6-8 Dec. 2005, Putrajaya, Malaysia. (pp. 488-492).
spellingShingle Alias, Rosidah
Ibrahim, Azmi
Mohd Shapee, Sabrina
Yahya, Mohamed Razman
Awang Mat, Abd. Fatah
Hashim, Mansor
Alumina substrate for high frequency applications
title Alumina substrate for high frequency applications
title_full Alumina substrate for high frequency applications
title_fullStr Alumina substrate for high frequency applications
title_full_unstemmed Alumina substrate for high frequency applications
title_short Alumina substrate for high frequency applications
title_sort alumina substrate for high frequency applications
url http://psasir.upm.edu.my/id/eprint/34001/
http://psasir.upm.edu.my/id/eprint/34001/1/34001.pdf