Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders
The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetall...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Trans Tech Publications
2013
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| Online Access: | http://psasir.upm.edu.my/id/eprint/28721/ http://psasir.upm.edu.my/id/eprint/28721/1/Effect%20of%20isothermal%20aging%202000%20hours%20on%20intermetallics%20formed%20between%20Ni.pdf |
| _version_ | 1848846194823921664 |
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| author | Mohamed Ariff, Azmah Hanim Ourdjini, Ali Idris, Siti Rabiatul Aisha Osman, Saliza Azlina |
| author_facet | Mohamed Ariff, Azmah Hanim Ourdjini, Ali Idris, Siti Rabiatul Aisha Osman, Saliza Azlina |
| author_sort | Mohamed Ariff, Azmah Hanim |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetallic morphology to coarser and dense structure. The intermetallic compound formed for the interconnection of the lead free solder changes with increased aging time from (Cu,Ni)6Sn5 compound to (Ni,Cu)3Sn4. At the end of the 2000 hours aging time, it changes to Ni3Sn4. This is the effect of Cu element availability during the intermetallics growth process. Starting from as reflow process, (Pd, Ni)Sn4 intermetallics formed near the interface of the solder joint. The formation of the (Pd, Ni)Sn4 intermetallics act like a diffusion barrier to slow down the growth of interface intermetallics. Lastly, Au element was detected in the Pd-Sn based intermetallic after aging more than 1000 hours. |
| first_indexed | 2025-11-15T08:58:50Z |
| format | Article |
| id | upm-28721 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T08:58:50Z |
| publishDate | 2013 |
| publisher | Trans Tech Publications |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-287212015-12-03T02:01:17Z http://psasir.upm.edu.my/id/eprint/28721/ Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders Mohamed Ariff, Azmah Hanim Ourdjini, Ali Idris, Siti Rabiatul Aisha Osman, Saliza Azlina The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetallic morphology to coarser and dense structure. The intermetallic compound formed for the interconnection of the lead free solder changes with increased aging time from (Cu,Ni)6Sn5 compound to (Ni,Cu)3Sn4. At the end of the 2000 hours aging time, it changes to Ni3Sn4. This is the effect of Cu element availability during the intermetallics growth process. Starting from as reflow process, (Pd, Ni)Sn4 intermetallics formed near the interface of the solder joint. The formation of the (Pd, Ni)Sn4 intermetallics act like a diffusion barrier to slow down the growth of interface intermetallics. Lastly, Au element was detected in the Pd-Sn based intermetallic after aging more than 1000 hours. Trans Tech Publications 2013 Article PeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/28721/1/Effect%20of%20isothermal%20aging%202000%20hours%20on%20intermetallics%20formed%20between%20Ni.pdf Mohamed Ariff, Azmah Hanim and Ourdjini, Ali and Idris, Siti Rabiatul Aisha and Osman, Saliza Azlina (2013) Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders. Advanced Materials Research, 650. pp. 194-199. ISSN 1022-6680; ESSN: 1662-8985 http://www.scientific.net/AMR.650.194 10.4028/www.scientific.net/AMR.650.194 |
| spellingShingle | Mohamed Ariff, Azmah Hanim Ourdjini, Ali Idris, Siti Rabiatul Aisha Osman, Saliza Azlina Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders |
| title | Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders |
| title_full | Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders |
| title_fullStr | Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders |
| title_full_unstemmed | Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders |
| title_short | Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders |
| title_sort | effect of isothermal aging 2000 hours on intermetallics formed between ni-pd-au with sn-4ag-0.5cu solders |
| url | http://psasir.upm.edu.my/id/eprint/28721/ http://psasir.upm.edu.my/id/eprint/28721/ http://psasir.upm.edu.my/id/eprint/28721/ http://psasir.upm.edu.my/id/eprint/28721/1/Effect%20of%20isothermal%20aging%202000%20hours%20on%20intermetallics%20formed%20between%20Ni.pdf |