APA (7th ed.) Citation

Mohamed Ariff, A. H., Ourdjini, A., Idris, S. R. A., & Osman, S. A. (2013). Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders. Trans Tech Publications.

Chicago Style (17th ed.) Citation

Mohamed Ariff, Azmah Hanim, Ali Ourdjini, Siti Rabiatul Aisha Idris, and Saliza Azlina Osman. Effect of Isothermal Aging 2000 Hours on Intermetallics Formed Between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders. Trans Tech Publications, 2013.

MLA (9th ed.) Citation

Mohamed Ariff, Azmah Hanim, et al. Effect of Isothermal Aging 2000 Hours on Intermetallics Formed Between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders. Trans Tech Publications, 2013.