Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field

Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field

NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode with and without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles. The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycl...

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Bibliographic Details
Main Authors: Ruthramurthy, Balachandran, Yow, Ho Kwang, Ong, Boon Hoong, Tan, Kar Ban, Kassim, Anuar, Wong, Hin Yong
Format: Article
Language:English
Published: Electrochemical Science Group 2011
Online Access:http://psasir.upm.edu.my/id/eprint/24904/
http://psasir.upm.edu.my/id/eprint/24904/1/Surface%20morphology%20and%20electrical%20properties%20of%20pulse%20electrodeposition%20of%20NiFe%20films%20on%20copper%20substrates%20in%20ultrasonic%20field.pdf

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