Application of total productive maintenance to reduce non-stick on pad problem in IC packaging.

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Application of total productive maintenance to reduce non-stick on pad problem in IC packaging.

Focus improvement activity was employed to improve front-end assembly yield in integrated circuit packaging. The top three yield losses in parts per million (ppm) in front-end assembly were contributed by the following defects: non-stick on pad (NSOP) (2715 ppm), chip and crack (782 ppm) and missing...

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Bibliographic Details
Main Authors:	Salit, Mohd Sapuan, Ismail, Napsiah, Dharmalingam, Sivakumar, Ismail, M. Y.
Format:	Article
Language:	English English
Published:	2012
Online Access:	http://psasir.upm.edu.my/id/eprint/23441/ http://psasir.upm.edu.my/id/eprint/23441/1/Application%20of%20total%20productive%20maintenance%20to%20reduce%20non.pdf

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