APA (7th ed.) Citation

Salit, M. S., Ismail, N., Dharmalingam, S., & Ismail, M. Y. (2012). Application of total productive maintenance to reduce non-stick on pad problem in IC packaging.

Chicago Style (17th ed.) Citation

Salit, Mohd Sapuan, Napsiah Ismail, Sivakumar Dharmalingam, and M. Y. Ismail. Application of Total Productive Maintenance to Reduce Non-stick on Pad Problem in IC Packaging. 2012.

MLA (9th ed.) Citation

Salit, Mohd Sapuan, et al. Application of Total Productive Maintenance to Reduce Non-stick on Pad Problem in IC Packaging. 2012.