Structural, morphology and electrical properties of layered copper selenide thin film
Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are stud...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Versita Warsaw and Springer
2009
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| Online Access: | http://psasir.upm.edu.my/id/eprint/16870/ http://psasir.upm.edu.my/id/eprint/16870/1/Structural%2C%20morphology%20and%20electrical%20properties%20of%20layered%20copper%20selenide%20thin%20film%20.pdf |
| Summary: | Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed. |
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