Lead free solder joint thermal condition in semiconductor packaging

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Lead free solder joint thermal condition in semiconductor packaging

Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to p...

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Bibliographic Details
Main Authors:	Harif, Muhammad Najib, Nadzri, Allina, Jusoff, Kamaruzaman
Format:	Article
Language:	English
Published:	Science Publications 2010
Online Access:	http://psasir.upm.edu.my/id/eprint/15427/ http://psasir.upm.edu.my/id/eprint/15427/1/ajassp.2010.949.953.pdf

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