APA (7th ed.) Citation

Harif, M. N., Nadzri, A., & Jusoff, K. (2010). Lead free solder joint thermal condition in semiconductor packaging. Science Publications.

Chicago Style (17th ed.) Citation

Harif, Muhammad Najib, Allina Nadzri, and Kamaruzaman Jusoff. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging. Science Publications, 2010.

MLA (9th ed.) Citation

Harif, Muhammad Najib, et al. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging. Science Publications, 2010.