System on Chip (SOC)-FPGA for multimode vehicle data communication

A method of manufacturing a high electron mobility transistor (1), said method comprising the steps of: − providing a target wafer (10) comprising a target substrate (100); − providing a donor wafer (20) comprising an epitaxial donor film (21); − bonding said donor film (21) to said target wafer (10...

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Main Authors: Aris, Ishak, Kamsani, Noor 'ain, Abdul Halin, Izhal
Format: Patent
Published: 2024
Online Access:http://psasir.upm.edu.my/id/eprint/115514/
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author Aris, Ishak
Kamsani, Noor 'ain
Abdul Halin, Izhal
author_facet Aris, Ishak
Kamsani, Noor 'ain
Abdul Halin, Izhal
author_sort Aris, Ishak
building UPM Institutional Repository
collection Online Access
description A method of manufacturing a high electron mobility transistor (1), said method comprising the steps of: − providing a target wafer (10) comprising a target substrate (100); − providing a donor wafer (20) comprising an epitaxial donor film (21); − bonding said donor film (21) to said target wafer (10); − separating said donor wafer (20) and said target wafer (10) along said first donor III-N layer (201), thereby forming on said target wafer (10) a top surface layer (221) of 200nm or less; − epitaxially growing an epitaxial III-N semiconductor layer stack (300) on top of said top surface layer (221); − forming a gate contact (41) in a gate region (401); and − forming a substrate galvanic contact (42) contacting said target substrate (100).
first_indexed 2025-11-15T14:26:18Z
format Patent
id upm-115514
institution Universiti Putra Malaysia
institution_category Local University
last_indexed 2025-11-15T14:26:18Z
publishDate 2024
recordtype eprints
repository_type Digital Repository
spelling upm-1155142025-03-06T05:53:43Z http://psasir.upm.edu.my/id/eprint/115514/ System on Chip (SOC)-FPGA for multimode vehicle data communication Aris, Ishak Kamsani, Noor 'ain Abdul Halin, Izhal A method of manufacturing a high electron mobility transistor (1), said method comprising the steps of: − providing a target wafer (10) comprising a target substrate (100); − providing a donor wafer (20) comprising an epitaxial donor film (21); − bonding said donor film (21) to said target wafer (10); − separating said donor wafer (20) and said target wafer (10) along said first donor III-N layer (201), thereby forming on said target wafer (10) a top surface layer (221) of 200nm or less; − epitaxially growing an epitaxial III-N semiconductor layer stack (300) on top of said top surface layer (221); − forming a gate contact (41) in a gate region (401); and − forming a substrate galvanic contact (42) contacting said target substrate (100). 2024 Patent NonPeerReviewed Ishak bin Aris (2024) System on Chip (SOC)-FPGA for multimode vehicle data communication. PI2024005657.
spellingShingle Aris, Ishak
Kamsani, Noor 'ain
Abdul Halin, Izhal
System on Chip (SOC)-FPGA for multimode vehicle data communication
title System on Chip (SOC)-FPGA for multimode vehicle data communication
title_full System on Chip (SOC)-FPGA for multimode vehicle data communication
title_fullStr System on Chip (SOC)-FPGA for multimode vehicle data communication
title_full_unstemmed System on Chip (SOC)-FPGA for multimode vehicle data communication
title_short System on Chip (SOC)-FPGA for multimode vehicle data communication
title_sort system on chip (soc)-fpga for multimode vehicle data communication
url http://psasir.upm.edu.my/id/eprint/115514/