Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies

QR Code

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies

The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electroni...

Full description

Bibliographic Details
Main Authors:	Dele-Afolabi, T.T., Ansari, M.N.M., Azmah Hanim, M.A., Oyekanmi, A.A., Ojo-Kupoluyi, O.J., Atiqah, A.
Format:	Article
Language:	English
Published:	Elsevier Editora Ltda 2023
Online Access:	http://psasir.upm.edu.my/id/eprint/110327/ http://psasir.upm.edu.my/id/eprint/110327/1/110327.pdf

Similar Items

Organic waste-derived pore formers for macroporous ceramics fabrication: a review on synthesis, durability properties and potential applications.
by: Dele-Afolabi, T.T., et al.
Published: (2024)

Performance assessment of Sn-based lead-free solder composite joints based on extreme learning machine model tuned by Aquila optimizer
by: Temitope T., Dele-Afolabi, et al.
Published: (2024)

Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
by: Hashim, Md. Amin
Published: (2011)

Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn-5Sb solder composites on Cu substrate
by: T. Temitope, Dele Afolabi, et al.
Published: (2019)

Harnessing sugarcane bagasse for bioenergy production: Current status, optimization, and future directions
by: Ojo-kupoluyi, O.J., et al.
Published: (2024)

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: K., Vidyatharran, et al.
Published: (2021)

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: Dele-Afolabi, T. T., et al.
Published: (2022)

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: Dele-Afolabi, Temitope T., et al.
Published: (2022)

Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
by: Dele-Afolabi, Temitope Theophilus
Published: (2015)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: M. A., Azmah Hanim, et al.
Published: (2020)

Fundamentals of microelectronic circuits
by: Motakabber, S. M. A., et al.
Published: (2012)

Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)

Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint
by: Theophilus, Dele-Afolabi Temitope, et al.
Published: (2015)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2020)

Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
by: Yamin, A.F.M., et al.
Published: (2012)

Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape
by: Lim, Shaw Fa
Published: (2020)

Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)

Fundamentals of microelectronic circuits, 2nd Edition
by: Motakabber, S. M. A., et al.
Published: (2018)

Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review
by: Dele-Afolabi, T. T., et al.
Published: (2014)

Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints
by: Li, Jianfeng, et al.
Published: (2018)

Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
by: Liew, Jian Ping
Published: (2016)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)

Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
by: Shaffiar, Norhashimah, et al.
Published: (2010)

Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride
by: Lee, S., et al.
Published: (2015)

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
by: Low, Pui Leng
Published: (2019)

Shear analysis of rice husk ash RHA reinforced tin- 0.7-copper composite solders on electroless nickel/immersion silver ENIAg surfaces
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2021)

Analog IC test and product engineering curriculum for Malaysia microelectronics industry
by: Kamsani, Noor Ain, et al.
Published: (2014)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)

Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
by: Nor Adhila Muhammad,, et al.
Published: (2014)

A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)

Solder Joint Reliability Of Flip Chip BGA Package
by: Lee, Kor Oon
Published: (2004)

Case Study Of ST Microelectronics N.V.
by: Ong, Melanie Ling Ling
Published: (2008)

USM-INSTITUT TEKNOLOGI BANDUNG TO COLLABORATE IN MICROELECTRONICS
by: MPRC, Pusat Media & Perhubungan Awam
Published: (2015)

USM, SILTERRA SIGNS AGREEMENT IN MICROELECTRONICS INDUSTRY
by: MPRC, Pusat Media & Perhubungan Awam
Published: (2016)

The master production schedule in MRP for microelectronic manufacturer
by: Cheam, Kai Wen, et al.
Published: (2020)