APA (7th ed.) Citation

Dele-Afolabi, T., Ansari, M., Azmah Hanim, M., Oyekanmi, A., Ojo-Kupoluyi, O., & Atiqah, A. (2023). Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies. Elsevier Editora Ltda.

Chicago Style (17th ed.) Citation

Dele-Afolabi, T.T, M.N.M Ansari, M.A Azmah Hanim, A.A Oyekanmi, O.J Ojo-Kupoluyi, and A. Atiqah. Recent Advances in Sn-based Lead-free Solder Interconnects for Microelectronics Packaging: Materials and Technologies. Elsevier Editora Ltda, 2023.

MLA (9th ed.) Citation

Dele-Afolabi, T.T, et al. Recent Advances in Sn-based Lead-free Solder Interconnects for Microelectronics Packaging: Materials and Technologies. Elsevier Editora Ltda, 2023.