Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations

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Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations

New formulations are produced for problems associated with multiple cracks in the upper part of thermoelectric-bonded materials subjected to remote stress using hypersingular integral equations (HSIEs). The modified complex stress potential function method with the continuity conditions of the resul...

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Bibliographic Details
Main Authors:	Mohd Nordin, Muhammad Haziq Iqmal, Hamzah, Khairum, Khashi’ie, Najiyah Safwa, Waini, Iskandar, Nik Long, Nik Mohd Asri, Fitri, Saadatul
Format:	Article
Published:	Multidisciplinary Digital Publishing Institute 2023
Online Access:	http://psasir.upm.edu.my/id/eprint/108047/

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