Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack
Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...
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| Format: | Article |
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Semarak Ilmu Publishing
2024
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| Online Access: | http://psasir.upm.edu.my/id/eprint/106298/ |
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| author | Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi |
| author_facet | Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi |
| author_sort | Mohd Nordin, Muhammad Haziq Iqmal |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultant Electric Force (REF) and Displacement Electric Function (DEF) to formulate the Hypersingular Integral Equations (HSIEs) associated with these problems. By applying the curved length coordinate method, the unknown functions of Crack Opening Displacement (COD), Electric Current Density (ECD), and Energy Flux Load (EFL) are mapped onto the square root singularity function. The resulting equations are then numerically solved using appropriate quadrature formulas, with the traction along the crack utilized as the right-hand term. The obtained COD, ECD and EFL functions is then used to compute the dimensionless Stress Intensity Factors (SIFs) in order to determine the stability behavior of TEBM weakened by an ICP. The numerical results provided demonstrate the dimensionless SIFs at the crack tips. These results exhibit excellent agreement with previous studies conducted on the subject. Additionally, it is observed that the dimensionless SIFs at the crack tips are influenced by factors such as the ratio of Elastic Constants (ECR), the geometry of the cracks, and the coefficients associated with the Electric Current Density (ECD). |
| first_indexed | 2025-11-15T13:53:36Z |
| format | Article |
| id | upm-106298 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-15T13:53:36Z |
| publishDate | 2024 |
| publisher | Semarak Ilmu Publishing |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-1062982024-05-12T13:20:26Z http://psasir.upm.edu.my/id/eprint/106298/ Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultant Electric Force (REF) and Displacement Electric Function (DEF) to formulate the Hypersingular Integral Equations (HSIEs) associated with these problems. By applying the curved length coordinate method, the unknown functions of Crack Opening Displacement (COD), Electric Current Density (ECD), and Energy Flux Load (EFL) are mapped onto the square root singularity function. The resulting equations are then numerically solved using appropriate quadrature formulas, with the traction along the crack utilized as the right-hand term. The obtained COD, ECD and EFL functions is then used to compute the dimensionless Stress Intensity Factors (SIFs) in order to determine the stability behavior of TEBM weakened by an ICP. The numerical results provided demonstrate the dimensionless SIFs at the crack tips. These results exhibit excellent agreement with previous studies conducted on the subject. Additionally, it is observed that the dimensionless SIFs at the crack tips are influenced by factors such as the ratio of Elastic Constants (ECR), the geometry of the cracks, and the coefficients associated with the Electric Current Density (ECD). Semarak Ilmu Publishing 2024 Article PeerReviewed Mohd Nordin, Muhammad Haziq Iqmal and Hamzah, Khairum and Nik Long, Nik Mohd Asri and Khashi’ie, Najiyah Safwa and Waini, Iskandar and Zainal, Nurul Amira and Sayed Nordin, Sayed Kushairi (2024) Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack. Journal of Advanced Research in Applied Mechanics, 113 (1). pp. 52-62. ISSN 2289 - 7895 https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373 10.37934/aram.113.1.5262 |
| spellingShingle | Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack |
| title | Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack |
| title_full | Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack |
| title_fullStr | Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack |
| title_full_unstemmed | Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack |
| title_short | Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack |
| title_sort | stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| url | http://psasir.upm.edu.my/id/eprint/106298/ http://psasir.upm.edu.my/id/eprint/106298/ http://psasir.upm.edu.my/id/eprint/106298/ |