Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings

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Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings

In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...

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Bibliographic Details
Main Authors:	Mohd Nordin, Muhammad Haziq Iqmal, Hamzah, Khairum, Nik Long, Nik Mohd Asri, Khashi’ie, Najiyah Safwa, Waini, Iskandar, Zainal, Nurul Amira, Sayed Nordin, Sayed Kushairi
Format:	Article
Published:	MDPI 2024
Online Access:	http://psasir.upm.edu.my/id/eprint/106276/

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