Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings
In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...
| Main Authors: | , , , , , , |
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| Format: | Article |
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MDPI
2024
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| Online Access: | http://psasir.upm.edu.my/id/eprint/106276/ |
| _version_ | 1848864733630824448 |
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| author | Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi |
| author_facet | Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi |
| author_sort | Mohd Nordin, Muhammad Haziq Iqmal |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) function method is used to formulate this crack phenomenon into the hypersingular integral equations (HSIEs) with the help of the continuity conditions of the resultant electric force and displacement electric function. The normal and tangential traction along the crack segment serves as the right-hand side of the integral equation. The HSIEs are solved numerically for the unknown crack opening displacement (COD) function, electric current density, and energy flux load using the appropriate quadrature formulas. The numerical solution presented the behavior of the dimensionless stress intensity factors (SIFs) at the crack tips which depend on the elastic constant’s ratio, the position of the crack, the electric conductivity, and the thermal expansion coefficients. |
| first_indexed | 2025-11-15T13:53:30Z |
| format | Article |
| id | upm-106276 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-15T13:53:30Z |
| publishDate | 2024 |
| publisher | MDPI |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-1062762024-05-12T13:19:01Z http://psasir.upm.edu.my/id/eprint/106276/ Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) function method is used to formulate this crack phenomenon into the hypersingular integral equations (HSIEs) with the help of the continuity conditions of the resultant electric force and displacement electric function. The normal and tangential traction along the crack segment serves as the right-hand side of the integral equation. The HSIEs are solved numerically for the unknown crack opening displacement (COD) function, electric current density, and energy flux load using the appropriate quadrature formulas. The numerical solution presented the behavior of the dimensionless stress intensity factors (SIFs) at the crack tips which depend on the elastic constant’s ratio, the position of the crack, the electric conductivity, and the thermal expansion coefficients. MDPI 2024 Article PeerReviewed Mohd Nordin, Muhammad Haziq Iqmal and Hamzah, Khairum and Nik Long, Nik Mohd Asri and Khashi’ie, Najiyah Safwa and Waini, Iskandar and Zainal, Nurul Amira and Sayed Nordin, Sayed Kushairi (2024) Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings. Journal of Advanced Research in Applied Mechanics, 113 (1). pp. 27-36. ISSN 2073-8994 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85183877145&url=10.37934%2faram.113.1.2736&partnerID=40&md5=42d4c6a3f85170714c1979412bb594ec 10.3390/sym13020235 |
| spellingShingle | Mohd Nordin, Muhammad Haziq Iqmal Hamzah, Khairum Nik Long, Nik Mohd Asri Khashi’ie, Najiyah Safwa Waini, Iskandar Zainal, Nurul Amira Sayed Nordin, Sayed Kushairi Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
| title | Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
| title_full | Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
| title_fullStr | Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
| title_full_unstemmed | Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
| title_short | Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
| title_sort | numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings |
| url | http://psasir.upm.edu.my/id/eprint/106276/ http://psasir.upm.edu.my/id/eprint/106276/ http://psasir.upm.edu.my/id/eprint/106276/ |