Investigating the structural transformation of individual Au-incorporated carbon nanofiber interconnect

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Investigating the structural transformation of individual Au-incorporated carbon nanofiber interconnect

Nowadays, a smaller electronic integrated circuit demands a smaller width and pitch of interconnect. Copper (Cu) interconnect, which is currently the most common, suffers from the size effect and grain boundary scattering. Hence, carbon materials such as carbon nanotubes (CNTs) and carbon nanofiber...

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Bibliographic Details
Main Authors:	Rosmi, Mohamad Saufi, Yaakob, Yazid, Mohd Yusop, Mohd Zamri, Md Isa, Illyas, Sidik, Siti Munirah, Abu Bakar, Suriani, Masaki, Tanemura
Format:	Article
Published:	Universiti Putra Malaysia 2022
Online Access:	http://psasir.upm.edu.my/id/eprint/101980/

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