Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

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Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT;...

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Bibliographic Details
Main Authors:	Dele-Afolabi, Temitope T., Hanim, M. A. Azmah, Vidyatharran, K., Amin Matori, Khamirul Amin, O. Saliza, Azlina, Recep, Çalin
Format:	Article
Published:	Springer Nature 2022
Online Access:	http://psasir.upm.edu.my/id/eprint/101956/

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