Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

QR Code

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT;...

Full description

Bibliographic Details
Main Authors:	Dele-Afolabi, Temitope T., Hanim, M. A. Azmah, Vidyatharran, K., Amin Matori, Khamirul Amin, O. Saliza, Azlina, Recep, Çalin
Format:	Article
Published:	Springer Nature 2022
Online Access:	http://psasir.upm.edu.my/id/eprint/101956/

Similar Items

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: Dele-Afolabi, T. T., et al.
Published: (2022)

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: K., Vidyatharran, et al.
Published: (2021)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2020)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: M. A., Azmah Hanim, et al.
Published: (2020)

Shear analysis of rice husk ash RHA reinforced tin- 0.7-copper composite solders on electroless nickel/immersion silver ENIAg surfaces
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2021)

Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
by: Krishna, Vidyatharran
Published: (2020)

Experimental and numerical investigation of plain and Ni-reinforced porous alumina ceramics composites produced with agro-waste pore formers
by: Theophilus, Dele-Afolabi Temitope
Published: (2018)

Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn-5Sb solder composites on Cu substrate
by: T. Temitope, Dele Afolabi, et al.
Published: (2019)

Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)

A comparison of plain ropivacaine 0.5% with plain bupivacaine 0.5% in spinal anaesthesia for orthopaedic surgery
by: Al-Meeri, Nasreldeen Mohamed Mosleh
Published: (2006)

Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
by: Lee , Liu Mei
Published: (2013)

Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
by: Lee, Liu Mei
Published: (2013)

Ultra-wide bandwidth electromagnetic wave and enhanced microwave absorption of Cu0.5Ni0.5Fe1.9Mn0.1O4 @CaTiO3 @MWCNTs nanocomposite in X-band frequency
by: Sani, Yusuf, et al.
Published: (2023)

Computer simulations of the interactions of the (0 1 2) and (0 0 1) surfaces of jarosite with Al, Cd, Cu2+ and Zn
by: Hudson-Edwards, K., et al.
Published: (2011)

Investigating the effect of porosity level and pore former type on the mechanical and corrosion resistance properties of agro-waste shaped porous alumina ceramics
by: Dele-Afolabi, Temitope T., et al.
Published: (2017)

Effect of Cu addition on the conductivity of xCuI-(1-x)AgI,(0.1 _ x _ 0.4) solid solutions / Chu Lee Peng
by: Chu, Lee Peng
Published: (2010)

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg
by: M.A., Rabiatul Adawiyah, et al.
Published: (2019)

A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)

Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)

Electrochemical corrosion behaviour of Pb-free SAC 105 and SAC 305 solder alloys: a comparative study
by: M. Fayeka,, et al.
Published: (2017)

Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2015)

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2015)

Superconducting properties of Y(Ba1-xCax)2Cu3O7-δ (0 ≤ x ≤ 0.05) system
by: Wan Shaaidi, Wan Nurul Ain, et al.
Published: (2010)

Research trend in the development of macroporous ceramic components by pore forming additives from natural organic matters: a short review
by: Dele-Afolabi, Temitope Theophilus, et al.
Published: (2017)

Research trend in the processing and application of macroporous ceramic components
by: Dele-Afolabi, Temitope Theophilus, et al.
Published: (2017)

Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2017)

The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
by: Yahya, Iziana, et al.
Published: (2012)

Magnetic and dielectric properties of polymer-coated Ni0.5Co0.3Cu0.2Fe2O4 nanostructures
by: Moradmard, Hanie, et al.
Published: (2016)

Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
by: Ghani, Fitriah Abdul
Published: (2018)

Structure and superconductivity in YBa₂Cu30₇_δ with additives of nano Ce0₂
by: Shaari, Abdul Halim, et al.
Published: (2009)

Synthesis and electrochemical studies of a superconductor, DyBa₂Cu₃0₇-δ
by: Kadri, Erina Farhani, et al.
Published: (2009)

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)

Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
by: Nadhrah, Murad
Published: (2021)

Impedance studies on Ca0.5Sr0.5Cu3Ti4O12 ceramic oxide
by: Mustafa, Mazni, et al.
Published: (2009)

Synthesis and characterization of of binary (CuO)0.6(CeO2)0.4 nanoparticles via a simple heat treatment method
by: Baqer, Anwar Ali, et al.
Published: (2018)

Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)

Ac conductivity of Ca1-xAxCu3Ti4O12 (A=Sr or Ba) with x=0.0 and 0.2 ceramics
by: Mustafa, Mazni, et al.
Published: (2009)

Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
by: Nabhan, Ismil
Published: (2007)