APA (7th ed.) Citation

Dele-Afolabi, T. T., Hanim, M. A. A., Vidyatharran, K., Amin Matori, K. A., O. Saliza, A., & Recep, Ç. (2022). Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Springer Nature.

Chicago Style (17th ed.) Citation

Dele-Afolabi, Temitope T., M. A. Azmah Hanim, K. Vidyatharran, Khamirul Amin Amin Matori, Azlina O. Saliza, and Çalin Recep. Interfacial Microstructure Evolution and Shear Strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects on Plain Cu and ENIAg Surface Finish. Springer Nature, 2022.

MLA (9th ed.) Citation

Dele-Afolabi, Temitope T., et al. Interfacial Microstructure Evolution and Shear Strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects on Plain Cu and ENIAg Surface Finish. Springer Nature, 2022.