Challenges in minimizing copper dissolution for lead free wave soldering in surface mount technology going towards green manufacturing

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Challenges in minimizing copper dissolution for lead free wave soldering in surface mount technology going towards green manufacturing

In surface mount technology, development toward green manufacturing by converting all leaded soldering processes to lead free soldering process has created a lot of challenges mainly in wave soldering process which led to copper dissolution to assemble board causing it to be scrapped if not containe...

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Bibliographic Details
Main Authors:	Arunasalam, Mageswaran, Leman, Zulkiflle, Baharudin, B. T. Hang Tuah, Sulaiman, Shamsuddin, Das, Charles Santhakumar Anthony
Format:	Article
Published:	Springer Nature 2022
Online Access:	http://psasir.upm.edu.my/id/eprint/100655/

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