APA (7th ed.) Citation

Arunasalam, M., Leman, Z., Baharudin, B. T. H. T., Sulaiman, S., & Das, C. S. A. (2022). Challenges in minimizing copper dissolution for lead free wave soldering in surface mount technology going towards green manufacturing. Springer Nature.

Chicago Style (17th ed.) Citation

Arunasalam, Mageswaran, Zulkiflle Leman, B. T. Hang Tuah Baharudin, Shamsuddin Sulaiman, and Charles Santhakumar Anthony Das. Challenges in Minimizing Copper Dissolution for Lead Free Wave Soldering in Surface Mount Technology Going Towards Green Manufacturing. Springer Nature, 2022.

MLA (9th ed.) Citation

Arunasalam, Mageswaran, et al. Challenges in Minimizing Copper Dissolution for Lead Free Wave Soldering in Surface Mount Technology Going Towards Green Manufacturing. Springer Nature, 2022.