A study on thermal management in electronic packaging components

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A study on thermal management in electronic packaging components

Thermal Management (TM) is the most important protection of the Integrated Circuit (IC) and electronic component. TM is one of the keys that has been purposes to the electronic packaging to cool and maintain the integrated circuit and electronic component.

Bibliographic Details
Main Author:	Awang Masri, A.A
Format:	Final Year Project Report / IMRAD
Language:	English English
Published:	Universiti Malaysia Sarawak , (UNIMAS) 2002
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://ir.unimas.my/id/eprint/2773/ http://ir.unimas.my/id/eprint/2773/1/A%20study%20on%20thermal%20management%20in%20electronic%20packaging%20components.pdf http://ir.unimas.my/id/eprint/2773/7/AWANG%20ALIAS%20%20ft.pdf

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