A study on thermal management in electronic packaging components
Thermal Management (TM) is the most important protection of the Integrated Circuit (IC) and electronic component. TM is one of the keys that has been purposes to the electronic packaging to cool and maintain the integrated circuit and electronic component.
| Main Author: | |
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| Format: | Final Year Project Report / IMRAD |
| Language: | English English |
| Published: |
Universiti Malaysia Sarawak , (UNIMAS)
2002
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| Subjects: | |
| Online Access: | http://ir.unimas.my/id/eprint/2773/ http://ir.unimas.my/id/eprint/2773/1/A%20study%20on%20thermal%20management%20in%20electronic%20packaging%20components.pdf http://ir.unimas.my/id/eprint/2773/7/AWANG%20ALIAS%20%20ft.pdf |
| _version_ | 1848835066408468480 |
|---|---|
| author | Awang Masri, A.A |
| author_facet | Awang Masri, A.A |
| author_sort | Awang Masri, A.A |
| building | UNIMAS Institutional Repository |
| collection | Online Access |
| description | Thermal Management (TM) is the most important protection of the Integrated Circuit (IC) and electronic component. TM is one of the keys that has been purposes to the electronic packaging to cool and maintain the integrated circuit and electronic component. |
| first_indexed | 2025-11-15T06:01:58Z |
| format | Final Year Project Report / IMRAD |
| id | unimas-2773 |
| institution | Universiti Malaysia Sarawak |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-15T06:01:58Z |
| publishDate | 2002 |
| publisher | Universiti Malaysia Sarawak , (UNIMAS) |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | unimas-27732023-02-08T06:44:57Z http://ir.unimas.my/id/eprint/2773/ A study on thermal management in electronic packaging components Awang Masri, A.A TK Electrical engineering. Electronics Nuclear engineering Thermal Management (TM) is the most important protection of the Integrated Circuit (IC) and electronic component. TM is one of the keys that has been purposes to the electronic packaging to cool and maintain the integrated circuit and electronic component. Universiti Malaysia Sarawak , (UNIMAS) 2002 Final Year Project Report / IMRAD NonPeerReviewed text en http://ir.unimas.my/id/eprint/2773/1/A%20study%20on%20thermal%20management%20in%20electronic%20packaging%20components.pdf text en http://ir.unimas.my/id/eprint/2773/7/AWANG%20ALIAS%20%20ft.pdf Awang Masri, A.A (2002) A study on thermal management in electronic packaging components. [Final Year Project Report / IMRAD] (Unpublished) |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Awang Masri, A.A A study on thermal management in electronic packaging components |
| title | A study on thermal management in electronic packaging components |
| title_full | A study on thermal management in electronic packaging components |
| title_fullStr | A study on thermal management in electronic packaging components |
| title_full_unstemmed | A study on thermal management in electronic packaging components |
| title_short | A study on thermal management in electronic packaging components |
| title_sort | study on thermal management in electronic packaging components |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://ir.unimas.my/id/eprint/2773/ http://ir.unimas.my/id/eprint/2773/1/A%20study%20on%20thermal%20management%20in%20electronic%20packaging%20components.pdf http://ir.unimas.my/id/eprint/2773/7/AWANG%20ALIAS%20%20ft.pdf |