Effect of different cooling rate on integrated circuit (ic) package

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Effect of different cooling rate on integrated circuit (ic) package

Currently, electronic products have shrunk into smaller size and in order to increase the input/output (I/O) counts as well as to improve performance. The goal of this study is to determine the reliability and strength of the solder joint formed at the integrated circuit (IC) interconnection with th...

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Bibliographic Details
Main Author:	Amir Syahmi, Nordin
Format:	Undergraduates Project Papers
Language:	English
Published:	2013
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://umpir.ump.edu.my/id/eprint/8391/ http://umpir.ump.edu.my/id/eprint/8391/1/CD8031_%40_56.pdf

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