Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy

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Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy

The effect of nickel addition towards the intermetallic compound properties that formed between Sn-Cu solder alloy and Cu substrate were investigated in this study. Since the intermetallic compounds generally have brittle nature and its thick formation could lead to serious reliability concerns.Add...

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Bibliographic Details
Main Authors:	Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Conference or Workshop Item
Language:	English
Published:	2014
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/6710/ http://umpir.ump.edu.my/id/eprint/6710/1/Effect_of_Nickel_addition_on_Intermetallic_Compound_Properties_of_Sn-Cu_Solder_Alloy.PDF

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