Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper

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Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper

Doping lead-free solders with minor additions of alloying and impurity elements such as Ni, Bi or Zn appears to have major effects on the growth of intermetallics (IMC) in solder joints during reflow soldering between the Sn-AgCu lead-free solders and the surface finish metallurgy. In this pape...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Ali, Ourdjini, Y.T., Chin
Format:	Conference or Workshop Item
Language:	English
Published:	2012
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/5204/ http://umpir.ump.edu.my/id/eprint/5204/1/IEMT2012-P131.pdf

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