Effect Of Solder Volume on Interfacial Reaction Between
SAC405 Solders and EN(B)EPIG Surface Finish

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Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish

The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini, Astuty, Amrin
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2014
Subjects:	T Technology (General) TN Mining engineering. Metallurgy
Online Access:	http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf

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