Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate

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Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate

Due to environmental concern, lead-free solder are taking the place of eutectic Sn-Pb solder in electronic packaging industry. Among various lead free alloys, Sn–Ag–Cu (SAC) alloys are leading lead-free candidate solders for various applications because it is offered better properties. This study in...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2012
Subjects:	TN Mining engineering. Metallurgy
Online Access:	http://umpir.ump.edu.my/id/eprint/5192/ http://umpir.ump.edu.my/id/eprint/5192/2/AMR.488-489.1375_from_kak_Ija_2012.pdf

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